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Description
Description
The insulation of HEAT SHRINK RING (SR)and BUTT (SB)consists of a special double layer. high-density polyethylene and polyolefin adhesive. After crimping, the insulation is heated to shrink the outer polyethylene layer and to melt the inner polyolefin liner. This action squeezes out gas while filling all voids resulting in a sealed connection.
Specifications
Specifications
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BrandNichifu
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Rated Current8 Ampere
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Length2.5 cm
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Width0.29 cm
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Height1.15 cm
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Weight0.01 kg
File Downloads
File Downloads
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Payment & Security
Payment methods
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Frequently Asked Questions
What is the SB-2218 Heat-shrinkable Butt Connector 8A Max used for?
The SB-2218 is an accessory connector designed for sealed electrical splice applications where a compact heat-shrinkable butt connector is needed. It is positioned for light electrical and cable/connector use cases in product categories such as accessories, connector terminals, and light connectors.
What makes the insulation on the SB-2218 different from a standard connector?
This model uses a special double-layer insulation structure made from high-density polyethylene on the outside and a polyolefin adhesive liner on the inside. According to the product description, that construction is intended to shrink and fill voids after heating so the finished connection is sealed.
Is the SB-2218 intended for sealed or exposed environments?
The product description specifically emphasizes a sealed connection and says the liner fills voids while squeezing out gas. That makes this model better suited to applications where environmental sealing is important than a basic non-sealing connector.
What is the maximum rated current for the SB-2218?
The SB-2218 has a rated current of 8.0000 A, and the product name also identifies it as 8A max. Buyers should use that published rating when checking whether this specific model fits their electrical load requirements.
How heavy is the SB-2218 connector?
The listed product weight is 0.0100 kg. That lightweight profile makes it appropriate for accessory and connector applications where compact components are preferred.
